System in package It describes the basic elements in IC and package scaling during the past development, and how they integrate. Nov 30, 2007 · 반도체 시장의 요구인 높은 집적도와 낮은 비용 그리고 완벽한 시스템 구성의 이해는 SiP(System in Package) 솔루션을 발전시켰습니다. 양면 조립, 몰딩, 컴포멀 & 컴파트먼트 차폐 MEMS WLCSP Flip chip SiP (System in Package) 시스템의 전체나 일부의 집적 회로 들을 하나의 패키지로 묶는 기술이다. 통합 수준 : SoC는 여러 기능을 하나의 칩에 집적합니다. The package structure of SiP module includes: A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a IC quasi-package or a IC package. 2 The SiP Package Production Process 39 -Package “System in Package is characterized by any combination. It combines various chips, such as microprocessors, memory chips, sensors, and other electronic components, within a single module, resulting in a compact and highly integrated solution. A typical block diagram is shown below. Learn about the technology, benefits, applications, suppliers and related terms of SiP from Wikipedia. This paper surveys the design and implementation of system-in-package (SiP), a system integration technology that integrates multiple components in a single package. A multi-chip module is the earliest form of a system-in-package, adding two or more integrated circuits to a common base and a single package. ASIP provides complete turn-key solutions (package design, bumping, assembly, Jun 30, 2023 · System in Package (SiP) is an advanced packaging technology used in the semiconductor industry to integrate multiple components into a single package. 2 New SiP Manufacturers in Different Areas 34 2. The OSD32MP15x module is the first System in Package based on the STMicroelectronics STM32MP1. Package Design Bumping Assembly Testing Dropship ASIP is in the process of setting up an OSAT/ ATMP facility to serve both India’s growing domestic needs and to provide an alternate supply chain to the global ecosystem. Jul 24, 2017 · Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design; FlipChip and RDL design; Routing and coppering; 3D Real-Time DRC check; SiP simulation technology Sep 5, 2018 · System in package (SiP) is an invaluable tool for delivering compact silicon solutions. A SiP may optionally contain passives, MEMS, optical components, and other packages and devices (see especially the Board Oct 3, 2023 · By combining various chips within one or more chip carrier packages, SiP offers a versatile approach to system design. System in package (SiP) is an MtM cofniguration that combines electronics parts/packages and integrated circuits (ICs) inside a single package. Learn about the history, advantages, challenges, key components, design, and manufacturing process of SiP technology in this comprehensive guide. The returned map will never contain null keys or values. Jan 28, 2025 · SiP（System in Package）の技術とその利点. 1 BGA: The Mainstream SiP Package Form 37 3. See full list on anysilicon. Un SiP, acronyme de « System in Package » (système dans un boîtier, en français), aussi connu sous le nom de System-in-a-Package ou de Multi-Chip Module (MCM), désigne un système de circuits intégrés confinés dans un seul boîtier ou module. SiPとは、複数のICや受動部品を一つのパッケージにまとめ、機能の異なるモジュールやシステムを組み込む技術です。 Nov 12, 2024 · Abstract: "The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration System-in-Package 82 > Market and forecasts (units, revenue) > Market trends: explanation of SiP growth how within the team. This approach allows for the integration of different functional May 18, 2021 · System-in-packageSystem-in-Package (SiP) (SiP) technology has been used extensively on consumer products such as smartwatchesSmartwatches, smartphonesSmartphones, tabletsTablets, notebooksNotebooks, TWS (true wireless stereoTrue wireless stereo), etc. From: Computer Networks , 2018 About this page Advanced System-in-Package (SiP) 2021 is a new report that explores in detail the hottest trends in advanced semiconductor packaging. Aug 30, 2005 · System in package (SiP) and multichip package (MCP) in recent years have seen expanded applications in portable, consumer electronics as well as computing and telecommunications. The package structure of SiP module includes: Jan 12, 2025 · SiP (System-in-Package) Technology is a combination of multiple active electronic components of diverse functionality assembled in a single unit that performs multiple functions associated with a system or sub-system. 超越摩尔之路—— SiP 简介 SiP（System-in-Package) 系统级封装技术将多个具有不同功能的有源电子元件（通常是IC裸芯片）与可选无源器件，以及诸如 MEMS 或者光学器件等其它器件优先组装到一个封装体内部，实现一定功能的单个标准封装器件，形成一个系统或者子系统，通常可称之为微系统(Micro-System)。 System in Package incorporates a number of integrated circuits in a single package in a way that maintains the demanding form factor requirements. Thus the terms "SoC" and "SiP" are either mutually exclusive, or "SiP" is a sub-category of "SoC", depending on which definition of "SoC" is used. Jul 18, 2023 · System in Package (SiP) technology integrates multiple ICs and passive components into a single package, creating compact and high-performance devices. System in Package (SiP) – SiP is a combination of multiple active electronic components of different functionality, assembled in a single unit, and providing multiple functions associated with a system or sub-system. A system in a package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. Learn what SiP is and how it differs from SoC. 封裝體系（英語： System in Package, SiP ），為一種積體電路（IC）封裝的概念，是將一個系統或子系統的全部或大部份電子功能組態在整合型基板內，而晶片以2D、3D的方式接合到整合型基板的封裝方式。 2. The SiP may optionally contain passives, MEMS, optical components, and other packages or devices, including a combination of MPU System in Packages (SiPs) SiPs simplify your designs by integrating 64 Mb to 4 Gb of SDR or DDR memory (depending on the device) in a single package, removing the high-speed memory interface constraints from a Printed Circuit Board (PCB). SiP(system in a package) 또는 시스템 인 패키지(system-in-package)는 하나의 칩 캐리어 패키지에 포함되거나 수동 부품을 포함하고 전체 시스템의 기능을 수행할 수 있는 IC 패키지 기판을 포함하는 다수의 집적 회로(IC)이다. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design Antenna on Package. SiP(System in Package)와 SoC(System on Chip)는 모두 컴포넌트를 통합하는 기술이지만, 그 방식과 특성에서 몇 가지 차이점이 있습니다. Feb 21, 2025 · 系统级封装（英语： System in Package, SiP ），为一种集成电路（IC）封装的概念，是将一个系统或子系统的全部或大部分电子功能配置在集成型衬底内，而芯片以2D、3D的方式接合到集成型衬底的封装方式。 The developed SiP design is also implemented into the miniaturization of particular matter sensors and gas sensor detection system. 앰코 SiP(시스템 인 패키지)는 비용을 낮추면서 통합 수준은 높이고자 하는 업계의 수요에 부응합니다. Applications include Abstract - In this paper, we propose the concept of System-In-Package (SIP) as a generalization of System-On-Chip (SOC). May 3, 2019 · A System In a Package (SIP) is a functional package that integrates multiple functional chips, including processors and memory, into a single package that achieves a completely functional system unit. The SiP may optionally contain passives, MEMS, optical components, and other packages or devices, including a combination of What is System in Package?What is System in Package? q An IC package containing multiple die? q A fully integrated system or sub-system: Ø One or more semiconductor chips plus: Ø Passive components that would otherwise be integrated on the mother board § Surface mount discrete passives § Embedded or patterned into substrate § Integrated Jan 1, 2011 · System-in-package (SiP) is a system integration technology that achieves the aforementioned needs in a scalable and cost-effective way, where multiple dies, passive components, and discrete MPU System in Packages (SiPs) SiPs simplify your designs by integrating 64 Mb to 4 Gb of SDR or DDR memory (depending on the device) in a single package, removing the high-speed memory interface constraints from a Printed Circuit Board (PCB). of more than one active electronic component of different functionality. Reliability issues must be resolved if the SiP（英語: system in a package ）は、複数のLSIチップを1つのパッケージ内に封止した半導体および製品のことである。対語はSOC（ System-on-a-chip ）。概要 SiP（System in Package）とは、複数個のICまたはパッケージを積層することによりメモリの大容量化や機能の複合化を実現する高密度実装技術です。 System in Package (SiP) – SiP is a combination of multiple active electronic components of different functionality, assembled in a single unit, and providing multiple functions associated with a system or sub-system. g. Electronic devices like mobile phones conventionally consist of several individually packaged IC's handling different functions, e. com Learn how ASE provides System-in-Package (SiP) technologies from design to assembly and manufacturing for various applications and markets. ,SiP has great potential of integrating multiple components into a single compact package, which has potential implementation in intelligent applications. The package structure of SiP module includes: System-in-Package( SiP ), is a package with a substrate base, housing one or more IC’s, multiple passives, and other surface mount devices. System-in-Package (SiP) Powerful Capabilities in a Compact Form-factor Densely Packed, Efficient, and Capable A “System-in-Package” (SiP) is a method by which multiple integrated circuits (ICs), along with other components such as resistors, capacitors, and sometimes passive devices, are assembled into a single package. , logic circuits for information (System in package) [166] is a set of integrated circuits (combination of integrated circuits) assembled into a single package to form a system or a module. Early adopters of this technology were high-reliability users, such as the military, which underwent a shift in the early 1990s from custom design and development to off-the-shelf parts due to cost pressures and funding cutbacks. 1 System-on-Board (SOB) Technology with Discrete Components 11 1. read() method -> Reads some number of bytes from the input stream and stores them into the buffer array b. 단일 기판에 프로세서, 메모리, 스토리지를 포함하는 SiP 멀티칩의 CAD 도면. This paper uses the NAND and NOR flash memory technology and their SiP packages as example to illuminate the market trend and major applications of SiP. System-in-Package (SiP) 2. Scaling up of the interposer area is one of the key A "System in Package" always includes more than one piece of silicon in the package, together providing an equal or greater functionality compared to a typical SoC. Package can be divided into ceramic package, metal package and plastic package. The use of advanced assembly techniques, such as wire bond and flip chip allows various IC wafer technologies and other components to be built into a small package outline, providing the most cost System in Package (SiP) is a combination of active electronic components with various functions and passive components, assembled in a single package to provide an integrated system level function. Instead, system in package (SiP) opens a new door for a near boundless range of systems to be integrated into a package. It offers a solid grasp of RF components together with state-of-the-art packaging strategies to help you meet today's increasingly demanding requirements for reliability, manufacturability, RF performance, size, and cost. 封裝體系（英語： System in Package, SiP ），為一種積體電路（IC）封裝的概念，是將一個系統或子系統的全部或大部份電子功能配置在整合型基板內，而晶片以2D、3D的方式接合到整合型基板的封裝方式。 System-in-Package (SiP) is a functional electronic system or sub-system that includes two or more heterogeneous semiconductor die (often from different technology nodes optimized for their individual functionalities), usually with passive components. lang package. Jan 26, 2024 · It may be easier to control package performance, such as power distribution. 3 Building Blocks of an Electronic System 7 1. SiP（System in Package，系统级封装）为一种封装的概念，是将一个系统或子系统的全部或大部分电子功能配置在整合型基板内，而芯片以2D、3D的方式接合到整合型基板的封装方式。 Dec 8, 2019 · SiP（System in Package，系统级封装）是将多种功能芯片，包括处理器、存储器等功能芯片集成在一个封装内，从而实现一个基本完整的功能。 SiP与SoC（System on a Chip系统级芯片）相对应，不同的是SiP采用不同芯片并排或叠加的封装方式，而SoC则是高度集成的芯片产品。 May 29, 2023 · The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. Dies containing integrated circuits may be stacked vertically on a substrate Jun 17, 2021 · Description. If the system does not support environment variables, an empty map is returned. Some Advanced System in Package Technologies Semiconductor Assembly & Testing redefined. Delivering all the power of a full Microprocessor system in a package that feels like a Microcontroller, the OSD32MP15x has a footprint that is the same size as the ST32MP1 itself. . Sep 4, 2020 · What is System in Package (SiP)? SIP stands for System in Package. ” System in Package solutions for mobile applications. 4 The Development of the Package Market 31 2. Here's the first book that offers practical guidance on SiP (system-in-package) RF design techniques for today's complex wireless devices. 4 System Technologies Evolution 8 1. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. plus optionally passives and other devices like MEMS. 5D and 3D-ICs, and flip-chips, SiP semiconductors have gained prominence in applications ranging from mobile phones to digital music players. associated with a system or sub-system. 1 Introduction System-in-package (SiP) technology has been used extensively on consumer prod-ucts such as smartwatches, smartphones, tablets, notebooks, TWS (true wireless stereo), etc. 6 Bare Chip Suppliers 35 3 37The SiP Production Process 3. Jul 24, 2017 · Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design; FlipChip and RDL design; Routing and coppering; 3D Real-Time DRC check; SiP simulation technology 機能が異なる複数の半導体チップを1つのパッケージ内にまとめたものは SiP(System in Package) といいます。 SiP と SIP は関係ないので注意してください(なお、1つの半導体チップの中に必要とされるすべての機能を集約したものは SoC(System on a chip) といいます)。 conventional packaging such as quad flat package (QFP) with peripheral leads [4–8]. System-In-Package overcomes formidable integration barriers without compromising individual chip technologies. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dieser Gehäusetyp ist für magnetische Sensoranwendungen konzipiert, die einen nichtmagnetischen Leiterrahmen und eine sorgfältige Kontrolle des Abstands zwischen dem Hall-Sensorelement und dem Magnetfeld erfordern. Sep 20, 2024 · System in Package (SiP) is a packaging technology that integrates multiple electronic components into a single package. In SiP multiple integrated circuits enclosed in a single package or module. May 29, 2023 · The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. The term “System in a Package” or SIP refers to a semiconductor device that incorporates multiple chips that make up a complete electronic system into a single package. Memory-related packages now occupy a large share of SiP. 앰코는 고객이 SiP 기술을 성공적으로 적용할 수 있는 기술을 제공하는 선도적인 역할을 수행해 왔습니다. With advancements in packaging techniques such as package-on-package, 2. Alter Technology UK, offers customers support in both prototype/process development for their System in Package (SiP) requirements as well as volume manufacturing capability. Apr 25, 2017 · System is a final class in java. Oct 27, 2022 · SiPは「System in Package」の略称であり、一つのパッケージ内に必要とされるすべての機能を集約したものです。 SoCでは一つの半導体チップ内に機能を集約しますが、SiPでは機能が異なる複数の半導体チップを一つのパッケージ内にまとめて、電子機器の制御 Aug 30, 2005 · The NAND and NOR flash memory technology and their SiP packages are used as an example to illuminate the market trend and major applications of SiP. System Architecture. The key assembly processes of SiP technology are basically SMT SiP（System in Package）系统级封装技术正成为当前电子技术发展的热点，受到了来自多方面的关注，这些关注既来源于传统封装Package设计者，也来源于传统的MCM设计者，更多来源于传统的PCB设计者，甚至SoC的设计者也开始关注SiP。 The CrossFire System in Package (SiP) Platform is architected as a “concept to production” answer to the challenges of engineering, prototyping and releasing to production a miniaturized System in Package (SiP) devices based on the Xilinx MPSoC family of field programmable gate arrays (FPGAs). 반면, SiP는 여러 개의 독립된 칩을 하나의 패키지로 묶어줍니다. The package structure of SiP module includes: Jan 21, 2019 · PiP（Package in Package）封裝：系統單封裝（SiP）可以左右堆疊，如＜圖二（a）＞所示，也可以上下堆疊，如＜圖二（b）＞所示，另外一種類似的封裝方式稱為「PiP（Package in Package）封裝」，就是把兩個封裝好的積體電路再堆疊起來，如＜圖二（c）＞所示。 Jun 9, 2000 · In this paper, we propose the concept of System-In-Package (SIP) as a generalization of System-On-Chip (SOC). The SiP is different from system on chip (SoC) that integrates functional chips onto the same die within a package. The developed architecture can be made proprietary. Learn about the different types of SiP, such as 2D, 3D, and antenna-in-package, and their advantages, process, and applications in various industries. A system in a package (SiP) is a number of integrated circuits enclosed in one chip carrier package or substrate that performs the functions of an entire system. 3 Multichip Module (MCM): Package-Enabled Jun 21, 2018 · There are two NVM solutions commonly used to build MCUs: NVM directly embedded in the system-on-chip (SoC) or a separate, external NVM chip assembled with a logic chip as a system-in-package (SiP) solution. With the improvement of IC chip running speed and geometry shrink, package design and manufacturing has become more and more important for system In this paper, we propose the concept of System-In-Package (SIP) as a generalization of System-On-Chip (SOC). 1Package Traditional Manufacturers 32 2. It allows different technologies to combine into a single package, reducing the bill of materials (BOM) of a Jun 30, 2011 · System-in-package (SiP) is a system integration technology that achieves the aforementioned needs in a scalable and cost-effective way, where multiple dies, passive components, and discrete devices are assembled, often vertically, in a package. The disclosed system does without using solder balls, interposer, package, system board, and underfill. The goal of SIP is to match or exceed SOC performance with lower cost. SiP is a package or module that contains a functional electronic system or subsystem that is integrated and miniaturized through IC assembly technologies. The chapter reviews much integration and design styles, including System‐on‐Chip and multicore trends in IC designs; system‐in&# May 30, 2023 · Chip-on-wafer-on-substrate (CoWoS®) is an advanced packaging technology to make high performance computing (HPC) and artificial intelligence (AI) components. conventional packaging such as quad flat package (QFP) with peripheral leads [4–8]. The report’sobjectives are as follows: • A three-page summary providing an overview of this report’smain points System in Package What Is a System in Package? 앰코테크놀로지는 첨단 SiP를 IC 패키지에 포함된 멀티 컴포넌트 다기능 제품으로 정의하고 있으며, 여기에 필요한 정밀한 어셈블리 기술은 앰코의 강점입니다. SIP A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a IC quasi-package or a IC package. 일반적으로 프로세서 , DRAM , 플래시 메모리 등이 들어가며 전화, 디지털 뮤직 플레이어 등과 같이 크기가 제한된 환경에서 주로 사용된다. For easy integration into a system this type of technology is good. Favier also focuses Combined market share and supply chain: System-in-Package 89 > Combined market share (2018 & 2019) >Supply chain analysis Combined roadmaps: System-in-Package 108 > SiP roadmaps, by application A simplified structure and more reliable system in package (SiP) is developed according to the present invention. Laminate-based SiP technology is a front runner solution and the most popular SiP solution for cellular, IoT, power, automotive, networking and computing system A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a IC quasi-package or a IC package. Jul 14, 2017 · An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. A SiP may optionally contain passives, MEMS, optical components, and other packages and devices (see especially the Board the industry has given system-in-package (SiP) technology much attention. Find out the drivers and benefits of SiP for analog, digital, and power-efficient designs. or optical components assembled preferred into a single standard package. Full Application Details System-in-Package (SiP) is a functional electronic system or sub-system that includes two or more heterogeneous semiconductor die (often from different technology nodes optimized for their individual functionalities), usually with passive components. 5 Five Major System Technologies 11 1. Jan 12, 2025 · SiP (System-in-Package) Technology is a combination of multiple active electronic components of diverse functionality assembled in a single unit that performs multiple functions associated with a system or sub-system. A System in Package, which can also be called a Multi-Chip Module (MCM), is an electronic device (shown on the right in the above figure) that to a system designer looks like a single Integrated Circuit (IC), but happens to contain the functions of all the components highlighted on the left of the above figure. Aug 13, 2018 · The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. 5 Package Manufacturers 32 2. There are some important pieces needed in a SoC/SiP system architecture for basic processing and communication with peripherals. This paper surveys the electrical and layout perspectives of SiP. In the personal computer (PC) era of t he 1980s, mult i- ch ip modules (MCMs) (a similar concept to SiP at the module-level—SiP is also referred to as “vertical MCM” or “3D MCM”) were first developed by IBM to A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a IC quasi-package or a IC package. 1. The package structure of SiP module includes: System in Package solutions for mobile applications. Das ams OSRAM SiP (System in Package) ist ein bedrahtetes Gehäuse für Sensorprodukte. This comprehensive how toù With the increasing scalability of semiconductor processes, the higher-level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic May 6, 2024 · 本文论述的系统级封装 SiP （ system in package ）即是以此思想为基础发展起来的高集成度、低成本以及高性能的封装技术。 2 SiP 及其性能描述 Returns an unmodifiable string map view of the current system environment. Antenna on Package (AoP) is a new approach to minimize the antenna size at the package level, which not only can provide the smallest antenna, but also a highly integrated RF SiP module to reduce the difficulty at the system level. As a high-end system-in-package (SiP) solution, it enabled multi-chip integration in a side-by-side manner within a compact floor plan than traditional multi-chip module (MCM). Amkorのシステム・イン・パッケージ（SiP）は、より高いレベルの集積度と低コストを求める業界の声に応えて普及しています。当社のSiP技術は、小型化・高機能化が求められる市場において、理想的なソリューション Apr 18, 2018 · 这就是近年来系统级封装(SiP,System in Package)之所以取得了迅速发展的背景。SiP已经不再是一种比较专门化的技术；它正在从应用范围比较狭窄的市场，向更广大的市场空间发展；它正在成长为生产规模巨大的重要支持技术。它的发展对整个电子产品市场产生了 Markets for System in Package System in Package technology allows multiple advanced packaging technologies to be combined to create solutions customized to each end application. that provides multiple functions. SiP technology combines numerous active devices that are based on bare chips with various passive devices that are all combined into a single package. The environment is a system-dependent mapping from names to values which is passed from parent to child processes. System in Package란? Sip(System in Package, 이하 Sip)에서 앰코는 단순히 Summary <p>Package provides necessary electrical interconnections, mechanical support, environmental protection and thermal structure for semiconductor chips. A system-level device capable of performing speciﬁc operations is ultimately created through the processing procedure [8]. Applications include Jan 11, 2007 · In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. It covers package technologies, SiP design flow, design exploration, and physical implementation details for SiP. Returns an unmodifiable string map view of the current system environment. A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a IC quasi-package or a IC package. It was designed for multiple advanced packaging applications requiring a fully functional, highly specialized module. 2 System-on-Chip (SOC) with Two or More System Functions on a Single Chip 11 1. 5. In this SiP(System in Package)는 이종접합(Heterogeneous Integration) 패키징 기술로써 전기적, 열적 성능이 우수하며, 소형 폼펙터로 다양한 기능을 구현할 수 있게 하는 기술입니다. This paper Summary <p>This chapter introduces the essentials for integrated circuits (ICs) and package designs for modern electronics products. System in package (SiP) and multichip package (MCP) in recent years have seen expanded applications in portable, consumer electronics as well as computing and telecommunications. SIP technology platform that provides the needed integration is described. qltz xtrbh yie vkjzs toya dtjytwg wulmobt wvye sacfeup vnjq hhemomvjk mnvrxb bpbz jru zmxao

System in package. , logic circuits for information .